| Wafer map type | Show Software binnings |
| Total dies tested | 2280 |
| Top 10 Software Binning | 1 | 3 | 8 | 10 | 11 | 4 | 9 |
| Color | |||||||
| Pass/Fail | P | F | F | F | F | F | F |
| Percentage | 86.7% | 4.7% | 4.3% | 2.1% | 1.4% | 0.5% | 0.3% |
| Total count | 1976 | 108 | 97 | 48 | 33 | 12 | 6 |
| File | C:/Program Files/Galaxy Examinator/MCC-I2.1/Wafer01-02-03-04.stdf |
| Parts processed | All Data / parts (any Bin) |
| Data from Sites | All sites |
| Lot | MJD39S00KY |
| Wafer ID | 01 |
| Wafer size | 15 cm |
| Die size | width: 0.4392 cm / height: 0.4439 cm |
| Wafer started | Wed Dec 03 11:58:46 2003 |
| Wafer ended | Wed Dec 03 12:57:17 2003 |
| Wafer tested in | 58 minutes 31 seconds |
| Average device test time | 6.247 sec. |
| Wafer area covered | LowX=11, LowY=11, HighX=30, HighY=44 |

| File | C:/Program Files/Galaxy Examinator/MCC-I2.1/Wafer01-02-03-04.stdf |
| Parts processed | All Data / parts (any Bin) |
| Data from Sites | All sites |
| Lot | MJD39S00KY |
| Wafer ID | 02 |
| Wafer size | 15 cm |
| Die size | width: 0.4392 cm / height: 0.4439 cm |
| Wafer started | Wed Dec 03 12:58:16 2003 |
| Wafer ended | Wed Dec 03 13:55:58 2003 |
| Wafer tested in | 57 minutes 42 seconds |
| Average device test time | 6.160 sec. |
| Wafer area covered | LowX=11, LowY=11, HighX=30, HighY=44 |

| File | C:/Program Files/Galaxy Examinator/MCC-I2.1/Wafer01-02-03-04.stdf |
| Parts processed | All Data / parts (any Bin) |
| Data from Sites | All sites |
| Lot | MJD39S00KY |
| Wafer ID | 03 |
| Wafer size | 15 cm |
| Die size | width: 0.4392 cm / height: 0.4439 cm |
| Wafer started | Wed Dec 03 13:56:58 2003 |
| Wafer ended | Wed Dec 03 14:55:34 2003 |
| Wafer tested in | 58 minutes 36 seconds |
| Average device test time | 6.256 sec. |
| Wafer area covered | LowX=11, LowY=11, HighX=30, HighY=44 |

| File | C:/Program Files/Galaxy Examinator/MCC-I2.1/Wafer01-02-03-04.stdf |
| Parts processed | All Data / parts (any Bin) |
| Data from Sites | All sites |
| Lot | MJD39S00KY |
| Wafer ID | 04 |
| Wafer size | 15 cm |
| Die size | width: 0.4392 cm / height: 0.4439 cm |
| Wafer started | Wed Dec 03 14:56:33 2003 |
| Wafer ended | Wed Dec 03 16:00:54 2003 |
| Wafer tested in | 1 hour 04 minutes 21 seconds |
| Average device test time | 1.693 sec. |
| Wafer area covered | LowX=11, LowY=11, HighX=30, HighY=44 |
