Wafer map



Wafer map type Show Software binnings
Total dies tested 1124



Top 10 Software Binning 1 8 3 10 11 9 4
Color
Pass/Fail P F F F F F F
Percentage 63.0% 19.0% 8.4% 3.5% 3.0% 3.0% 0.2%
Total count 708 213 94 39 34 34 2



File C:/Program Files/Galaxy Examinator/MCC-I2.1/Wafer05-06.stdf
Parts processed All Data / parts (any Bin)
Data from Sites All sites
Lot MJD21H00KY
Wafer ID 01
Wafer size 15 cm
Die size width: 0.4392 cm / height: 0.4439 cm
Wafer started Thu Dec 04 09:17:00 2003
Wafer ended Thu Dec 04 10:15:36 2003
Wafer tested in 58 minutes 36 seconds
Average device test time 6.256 sec.
Wafer area covered LowX=11, LowY=11, HighX=30, HighY=44





File C:/Program Files/Galaxy Examinator/MCC-I2.1/Wafer05-06.stdf
Parts processed All Data / parts (any Bin)
Data from Sites All sites
Lot MJD21H00KY
Wafer ID 02
Wafer size 15 cm
Die size width: 0.4392 cm / height: 0.4439 cm
Wafer started Thu Dec 04 10:16:37 2003
Wafer ended Thu Dec 04 11:12:54 2003
Wafer tested in 56 minutes 17 seconds
Average device test time 3.004 sec.
Wafer area covered LowX=11, LowY=11, HighX=30, HighY=44







Report created with: Examinator Characterization - V3.4 B11 - www.galaxysemi.com