
Design Team
R.Beccherle, G.Comes, G.Darbo, P.Denes, P.Fischer,
K.Kloukinas, I.Peric, P.Morettini, C.Schiavi.
Specification Documents for the MCC-I2.1
- Introduction
- Command Decoder - CMD [PDF]
- Register Bank - REG [PDF]
- Receiver - REC [PDF]
- Event Builder - EVB [PDF]
- Timing Trigger Control
- Input/Output data format [PDF]
- Chip size & I/O pads
Chip Simulation (SimPix)
- Status of the chip simulation and test vector description [HTML]
Production Test of the MCC-I2.1
- Chip production test made by Delta in Denmark.
- Document with test specifications and results for the 6 tested MCC-I2.1 wafers [PDF].
- Chip passing the test (failures and flags), Production Data Base and wafe coordinates [ HTML, excel]
- Wafer maps and logfiles with test results for all dies:
- Wafer analysis made with Galaxy Examinator: (note wafer maps are mirrored wrt X axis)
- Analysis of results in excel format: here.
- Test vectors used for production test: here.
Wire Bonding & I/O
- MCC-I2.1 I/O pad positions: [PDF, excel]
- Wirebonding diagram to FlexHybrid 5.x: [1] [2]
FE-I3 & MCC-I2.1 PRR
- Agenda of the Production Readiness Review for MCC and FE is here, the talks for the MCC part of the review:
- G. Darbo, Overview of MCC updates since FDR [PDF].
- R. Beccherle, Overview of MCC specification updates since FDR [PDF].
- G. Gagliardi, Irradiation studies on MCC [PDF].
- R. Beccherle, Production testing of MCC [PDF].
- Report from the referee [PDF]

Please address comments or suggestions to: Giovanni Darbo
Last updated: Thu, Nov 4, 2004