Design Team

R.Beccherle, G.Comes, G.Darbo, P.Denes, P.Fischer,

K.Kloukinas, I.Peric, P.Morettini, C.Schiavi.

Specification Documents for the MCC-I2.1

Chip Simulation (SimPix)

Production Test of the MCC-I2.1 

    1. Wafers 01, 02, 03 & 04.
    2. Wafers 05 & 06.

Wire Bonding & I/O

  • MCC-I2.1 I/O pad positions: [PDF, excel]
  • Wirebonding diagram to FlexHybrid 5.x: [1] [2]

FE-I3 & MCC-I2.1 PRR


 

Please address comments or suggestions to: Giovanni Darbo
Last updated: Thu, Nov 4, 2004