Tile-1, type SEIKO, module detector (ALENIA bumps)
Bare module, electronics FE_B, ALENIA bumps, flip-chip in Genoa lab (11/99)
Flex Hybrid 1.1, sensor CiS C1c, electronics FE_B, ALENIA bumps and flip-chip (03/00)
Flex Hybrid 1.1, sensor CiS C1c, thinned electronics FE_B, ALENIA bumps and flip-chip, X-ray analysis (04/00)
Flex Hybrid 1.1, sensor CiS C1c, thinned electronics FE_B, ALENIA bumps and flip-chip, X-ray analysis (05/00)
Flex Hybrid 2.x, sensor 3695-02 SMD CiS, thinned electronics FE_B, ALENIA bumps and flip-chip (04/01)
Flex Hybrid 2.x, sensor 3696-15 LAD CiS, thinned electronics FE_B, ALENIA bumps and flip-chip (06/01)
Flex Hybrid 2.x, sensor 3289-04 C1c, electronics FE_B, ALENIA bumps and flip-chip (07/01)
Maintened By Mario Cervetto (last update: