SENSORS in ATLAS Pixel Production Database



     Java applications
     To upload or trash sensor Wafer Items (all the substructures) please get applications-SensorWafer-PDB.zip and unzip it.
        The file contains:

        command files: UploadWaferData.BAT and TrashSensorWafer.BAT
        an input file example WaferData.txt .for Wafer upload
        the archive file SENSORWAFER.jar to be added to the CLASSPATH environment variable.

        To upload Sensor Test data please get the applications-PDB.zip and unzip it.
        The file contains input file examples for all Sensor tests.

        Add the file PIXTEST_1_02_P.jar to the CLASSPATH environment variable.

        Here is the example of Autoexec.bat file (java-related lines):
        set PATH=%PATH%;C:\jdk1.2.2\bin
       setCLASSPATH=%CLASSPATH%;C:\PixelPDB\classes111.zip;C:\PixelPDB\SENSORWAFER.jar;C:\PixelPDB\PIXTEST_1_02_P.jar;.

        To run the application:

        C:\atlas\measurement > java UploadTestData
        for Test data upload

        See General Help to learn more about java applications.

        DO NOT FORGET to change the attribute PASSED to YES for good Items (by default it is set to NO).

        NOTE:  for Tesla sensors or diodes, NOT PASSED usually doesn't mean broken, but
        indicates a too high, but stable leakage current. For example, most of the Single Chips from
        the wafer 20210120011400 (04-09) are still usable.

        The latest QA documents are in:
        https://edms.cern.ch/document/109186/2
 

       To ship Sensor Wafer please get the applications-SHIP-PDB.zip and unzip it.

        The files which you need are:
        SHIPMENTS.jar    to be added to the CLASSPATH variable,
        SendSensorWafer.BAT    coomand file to send a Wafer,
        SENSORSHIP.txt       example of the input file for Wafer sending,
        MultiReceive.BAT       command file to receive the Shipment containing a Wafer.
 

     The map of Sensor wafer


 

The Sensors subsystem part identifier has the format:

2021 01 v bbb ww tt

where

01– subsystem code
v– vendor code:

         0:     prototype sensors, in that case the bbb part of the number has the value:

            1bb for CiS prototypes,
           2bbfor IRST prototypes,
           3bbfor Seiko prototypes,
           4bb for Tesla prototypes,

                 where bb is the batch number.

         1: CiS sensors,
         2: Tesla sensors,

bbb – batch number,
ww – wafer number,
tt – wafer substructure number (tile, chips, etc, see fig.1).
 
 

Position of the scratch patterns