command files: UploadWaferData.BAT and TrashSensorWafer.BAT
an input file example
WaferData.txt
.for Wafer upload
the archive file
SENSORWAFER.jar to be added to the CLASSPATH environment
variable.
To upload
Sensor Test data please get the applications-PDB.zip
and unzip it.
The file contains input
file examples for all Sensor tests.
Add the file PIXTEST_1_02_P.jar to the CLASSPATH environment variable.
Here is the example of
Autoexec.bat
file
(java-related lines):
set
PATH=%PATH%;C:\jdk1.2.2\bin
To run the application:
C:\atlas\measurement >
java
UploadTestData
for Test data upload
See General Help to learn more about java applications.
DO NOT FORGET to change the attribute PASSED to YES for good Items (by default it is set to NO).
NOTE: for Tesla
sensors or diodes, NOT
PASSED usually doesn't mean broken,
but
indicates
a too high, but stable leakage current. For example, most of the Single
Chips from
the
wafer 20210120011400
(04-09)
are still usable.
The latest QA documents are
in:
https://edms.cern.ch/document/109186/2
To ship Sensor Wafer please get the applications-SHIP-PDB.zip and unzip it.
The files which you
need are:
SHIPMENTS.jar
to be added to the CLASSPATH variable,
SendSensorWafer.BAT
coomand file to send a Wafer,
SENSORSHIP.txt
example of the input file for Wafer sending,
MultiReceive.BAT
command file to receive the Shipment containing a Wafer.
The map of Sensor wafer
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The Sensors subsystem part identifier has the format:
2021 01 v bbb ww tt
where
01– subsystem code
v– vendor code:0: prototype sensors, in that case the bbb part of the number has the value:
1bb for CiS prototypes,
2bbfor IRST prototypes,
3bbfor Seiko prototypes,
4bb for Tesla prototypes,where bb is the batch number.
1: CiS sensors,
2: Tesla sensors,bbb – batch number,
ww – wafer number,
tt – wafer substructure number (tile, chips, etc, see fig.1).
Position of the scratch patterns